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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
Physical and Fuzzy Logic Modeling of a Flip-Chip Thermocompression Bonding Process
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Flip-Chip connections using gold-to-gold, gold-to-aluminum, or gold-to-solder bondings or contacts enhanced by epoxy are low-cost alternatives to soldering. To assist their technology advancements, ...
Study of an Air Cooling Scheme for 3-D Packaging
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An air cooling scheme is proposed for 3-D packaging. It consists of converging, impinging, and diverging flows among stacked circuit packs. Its cooling concept is demonstrated by experimental ...