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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-3 of 3
The Distribution of the Stress Intensity Factor Along the Front of the Growing Crack in an Optical Glass Fiber
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The stress intensity factor K1 along the front edge of a growing small crack in a silica optical fiber was evaluated by 3-D boundary element analysis based on the crack geometry observed ...
Direct Measurement of the Adhesive Fracture Resistance of CVD Diamond Particles
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Diamond film produced by chemical vapor deposition (CVD) is being used in the electronics industry because of their excellent properties. In order to measure the adhesive strength of CVD diamond, ...
A New Approach to Calculate Atomic Flux Divergence by Electromigration
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this paper, a new calculation method of the atomic flux divergence used to predict the formation of electromigration-induced void is proposed by considering two-dimensional distributions of ...