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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-3 of 3
A Brief Overview of Recent Developments in Thermal Management in Data Centers
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Data centers are mission critical facilities that typically contain thousands of data processing equipment, such as servers, switches, and routers. In recent years, there has been a boom in data center usage, leading their ...
Solving Thermal Issues in a Three Dimensional Stacked Quad Core Processor by Microprocessor Floor Planning, Microchannel Cooling, and Insertion of Through Silicon Vias
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The electronics industry is heading toward the threedimensional (3D) microprocessor to cope with higher computing workloads. The 3D stacking of the processor and the memory components reduces the communication delay in ...
Failure Analysis of Direct Liquid Cooling System in Data Centers
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In this paper, the impact of direct liquid cooling (DLC) system failure on the information technology (IT) equipment is studied experimentally. The main factors that are anticipated to affect the IT equipment response ...