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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper investigated the effect of heat spreading on the boiling of the Novec 649™ for two-phase immersion cooling of electronics. Reference pool boiling tests were performed by attaching a 25.4 mm by 25.4 mm square ...
Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: In a two-phase immersion cooling system, boiling on the spreader surface has been experimentally found to be nonuniform, and it is highly related to the surface temperature and the heat transfer coefficient. An experimentally ...