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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Structural Design of Land Grid Array Loading Mechanisms for Intel Central Processor Unit Stack Retention
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: For more than a decade, land grid array (LGA) has been one of the main central processor unit (CPU) packages developed at Intel and AMD, and widely used in different computer systems. LGA loading mechanism has become more ...