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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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A Numerical Model to Predict the Thermal and Psychrometric Response of Electronic Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper introduces a general computational model for electronic packages, e.g., cabinets that contain electronic equipment. A simplified physical model, which combines principles of classical ...