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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-3 of 3
Thermomechanical Fatigue Life Prediction of 63Sn/37Pb Solder
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Isothermal and thermomechanical fatigue of 63Sn/37Pb solder is studied under total strain-controlled tests. A standard definition of failure is proposed to allow inter-laboratory comparison. Based ...
Isothermal Fatigue of 63Sn-37Pb Solder
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The effects of aging, strain range, hold time at maximum strain and temperature on the isothermal fatigue life of bulk 63Sn-37Pn solder samples over the total strain range (Δ εT ) from 0.3 ...
Micromechanical Method to Predict Fatigue Life of Solder
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Fatigue lifetimes of low-tin high-lead and tin-lead eutectic solders under total strain controlled tension-tension tests were studied in this paper. Based on the stress and strain micro-macro ...