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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
A Shape Optimal Design Methodology for Packaging Design
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Shape optimal design methodology has been used as a design tool in the automotive and aerospace industries for quite some time now. In the present work the hybrid natural shape optimal design ...
Stress Analyses of Flip TAB Interconnects in Multi-Chip Module Assembly
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Flip Tape Automated Bond (FTAB) interconnect is one of the leading candidates for device to substrate interconnection in a high performance Multi-Chip Module (MCM). The TAB interconnect becomes ...