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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
Microelectronics and the Built-Up-Bar Theory
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The Built-up-Bar (BUB) theory is presently gaining recognition in microelectronics. This theory offers a useful method for computing stresses and strains in multilayered structures. However, it ...
Interlaminar Stresses in Layered Beams
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An effective numerical procedure is developed for calculation of interlaminar shear and peeling stresses in layered beams. This procedure is based on the Built-up-Bar theory.