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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-3 of 3
Some Effects of Water Immersion on the Mechanical Behavior of a Polyimide Film
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Absorbed moisture is generally thought to have a plasticizing effect upon the mechanical behavior of polymers. This paper presents some experimental results illustrating the effects of water ...
Influence of Polymer Viscoelasticity on a Bending Bilayer
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The bending bilayer technique is commonly employed to provide an empirical assessment of the often significant thermal stresses that develop in thin polymer films used in microelectronic packaging. ...
Finite Element Viscoelastic Analysis of Temperature and Moisture Effects in Electronic Packaging
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Several workers have demonstrated the presence of singular stress fields near the edge of a bimaterial interface subject to thermal gradients. Many of the analyses in the literature are limited ...