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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
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Experimental Characterization of Two-Phase Cold Plates Intended for High-Density Data Center Servers Using a Dielectric Fluid
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: High-performance computing (HPC) data centers demand cutting edge cooling techniques like direct contact liquid cooling (DCLC) for safe and secure operation of their high-power density servers. The two-phase flow boiling ...