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Journal of Electronic Packaging
EISSN: 1944-7078
ISSN: 1530-9827
Priority: 4
Publisher: American Society of Mechanical Engineers
Description: The Journal of Computing and Information Science in Engineering publishes archival research results and advanced technical applications More ...
Now showing items 1-2 of 2
Multilayer Conductive Metallization With Offset Vias Using Aerosol Jet Technology
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The transition of additive printed electronics into high-volume production requires process consistency to allow quality control of the manufactured product. Process recipes are needed for multilayer substrates with z-axis ...
Process Development for Printed Copper With Surface Mount Devices on Inkjet Metallization
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Printed electronics is a fastest growing and emerging technology that have shown much potential in several industries including automotive, wearables, healthcare, and aerospace. Its applications can be found not only in ...