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ASME ( American Society of Mechanical Engineers )
Description: The American Society of Mechanical Engineers (ASME) is a professional association that, in its own words, "promotes the art, science, and practice of multidisciplinary engineering and allied sciences around the globe" via "continuing education, training and professional development, codes and standards, research, conferences and publications, government relations, and other forms of outreach." ASME is thus an engineering society, a standards organization, a research and development organization, a lobbying organization, a provider of training and education, and a nonprofit organization. Founded as an engineering society focused on mechanical engineering in North America, ASME is today multidisciplinary and global.
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RISProcess Modeling and Thermal/Mechanical Behavior of ACA/ACF Type Flip-Chip Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Development of flip-chip-on-glass (FCOG) assembly technology using anisotropic conductive adhesive/film (ACA/ACF) is currently underway to achieve fine pitch interconnections between driver IC and ...
Strength Evaluation of Plastic Packages During Solder Reflow Process Using Stress Intensity Factors of V-Notch
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A crack initiated from a V-notch corner in the molding resin, such as a corner of die pad, is one of the main causes of the failure in plastic packages. The stress intensity factors of ...
Forced Convective Cooling Enhancement of Electronic Package Configurations Through Self-Sustained Oscillatory Flows
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Two-dimensional arrangements of electronic packages surface mounted to a printed circuit board represent grooved-channel geometries. For a certain range of Reynolds numbers, these geometries excite ...
A New Accurate Closed Form Analytical Solution for Junction Temperature of High Powered Devices
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The peak junction temperature has a profound effect on the operational lifetime and performance of high powered microwave devices. Although numerical analysis can help to estimate the peak junction temperature, it can be ...
Impact Isolation Through the Use of Compliant Interconnects for Microelectronic Packages
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Firstlevel and secondlevel compliant interconnect structures are being pursued in universities and industries to accommodate the differential displacement induced by the coefficient of thermal expansion mismatch between ...
The Alignment Shift Formation Mechanism of Thin Film Based DWDM Module With Solder Assembly Packaging
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thermal residual plastic deformation of bond joints on thin film based DWDM module under thermal cycles loading was investigated using three-dimensional finite element analysis. Finite element ...
Lithium Doped Polyethylene-Glycol-Based Thermal Interface Pastes for High Thermal Contact Conductance
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Polyethylene-glycol-based thermal interface paste containing trifluoroacetic acid lithium salt (1.5 wt. percent optimum) and boron nitride particles (∼18.0 vol. percent optimum), as well as water ...
Performance of a Conduction Cooling Module
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A piston-type conduction cooling module for PCB-mounted IC’s has been developed and tested. Analysis of performance has been made using a finite difference scheme for the conduction piston. The ...
An Experimental and Numerical Study of a Liquid Mixing Device for Microsystems
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: A microfluidic mixing device for microsystems with electroosmotic flow (EOF)-driven liquid pumping is proposed and examined experimentally and numerically. Microchannels with SiO2 or Al2O3 wall are ...
On Failure Mechanisms in Flip Chip Assembly—Part 2: Optimal Underfill and Interconnecting Materials
Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The physics explored in this investigation enables short-time scale dynamic phenomenon to be correlated with package failure modes such as solder ball cracking and interlayer debond. It is found ...