YaBeSH Engineering and Technology Library

    • Journals
    • PaperQuest
    • YSE Standards
    • YaBeSH
    • Login
    View Item 
    •   YE&T Library
    • ASME
    • Journal of Manufacturing Science and Engineering
    • View Item
    •   YE&T Library
    • ASME
    • Journal of Manufacturing Science and Engineering
    • View Item
    • All Fields
    • Source Title
    • Year
    • Publisher
    • Title
    • Subject
    • Author
    • DOI
    • ISBN
    Advanced Search
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Archive

    Thermal Stresses in Elastic Plates With Elliptic Holes

    Source: Journal of Manufacturing Science and Engineering:;1974:;volume( 096 ):;issue: 003::page 827
    Author:
    K. S. Rao
    ,
    M. N. Bapu Rao
    ,
    T. Ariman
    DOI: 10.1115/1.3438448
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The temperature and membrane stress distributions in an elastic square plate with an insulated central elliptic hole are investigated. The temperature varies along coordinates within the plane. The temperature distribution is determined as the solution of the steady state heat conduction equation, then the membrane stresses due to the temperature are analyzed. For both steps, the free edge conditions around the insulated elliptic hole as well as the boundary conditions at the fully restrained outer edges of the plate are satisfied at selected points by the method of least square point matching. The formulation is valid for any arbitrary orientation of the major axis of the elliptic hole. The numerical results for temperature distribution and membrane stresses are presented for two orientations and compared with the corresponding results for a circular hole.
    keyword(s): Temperature , Heat conduction , Stress , Thermal stresses , Boundary-value problems , Elastic plates , Equations , Membranes , Steady state AND Temperature distribution ,
    • Download: (501.5Kb)
    • Show Full MetaData Hide Full MetaData
    • Get RIS
    • Item Order
    • Go To Publisher
    • Price: 5000 Rial
    • Statistics

      Thermal Stresses in Elastic Plates With Elliptic Holes

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/165004
    Collections
    • Journal of Manufacturing Science and Engineering

    Show full item record

    contributor authorK. S. Rao
    contributor authorM. N. Bapu Rao
    contributor authorT. Ariman
    date accessioned2017-05-09T01:38:34Z
    date available2017-05-09T01:38:34Z
    date copyrightAugust, 1974
    date issued1974
    identifier issn1087-1357
    identifier otherJMSEFK-27612#827_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/165004
    description abstractThe temperature and membrane stress distributions in an elastic square plate with an insulated central elliptic hole are investigated. The temperature varies along coordinates within the plane. The temperature distribution is determined as the solution of the steady state heat conduction equation, then the membrane stresses due to the temperature are analyzed. For both steps, the free edge conditions around the insulated elliptic hole as well as the boundary conditions at the fully restrained outer edges of the plate are satisfied at selected points by the method of least square point matching. The formulation is valid for any arbitrary orientation of the major axis of the elliptic hole. The numerical results for temperature distribution and membrane stresses are presented for two orientations and compared with the corresponding results for a circular hole.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleThermal Stresses in Elastic Plates With Elliptic Holes
    typeJournal Paper
    journal volume96
    journal issue3
    journal titleJournal of Manufacturing Science and Engineering
    identifier doi10.1115/1.3438448
    journal fristpage827
    journal lastpage832
    identifier eissn1528-8935
    keywordsTemperature
    keywordsHeat conduction
    keywordsStress
    keywordsThermal stresses
    keywordsBoundary-value problems
    keywordsElastic plates
    keywordsEquations
    keywordsMembranes
    keywordsSteady state AND Temperature distribution
    treeJournal of Manufacturing Science and Engineering:;1974:;volume( 096 ):;issue: 003
    contenttypeFulltext
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian