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contributor authorK. S. Rao
contributor authorM. N. Bapu Rao
contributor authorT. Ariman
date accessioned2017-05-09T01:38:34Z
date available2017-05-09T01:38:34Z
date copyrightAugust, 1974
date issued1974
identifier issn1087-1357
identifier otherJMSEFK-27612#827_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/165004
description abstractThe temperature and membrane stress distributions in an elastic square plate with an insulated central elliptic hole are investigated. The temperature varies along coordinates within the plane. The temperature distribution is determined as the solution of the steady state heat conduction equation, then the membrane stresses due to the temperature are analyzed. For both steps, the free edge conditions around the insulated elliptic hole as well as the boundary conditions at the fully restrained outer edges of the plate are satisfied at selected points by the method of least square point matching. The formulation is valid for any arbitrary orientation of the major axis of the elliptic hole. The numerical results for temperature distribution and membrane stresses are presented for two orientations and compared with the corresponding results for a circular hole.
publisherThe American Society of Mechanical Engineers (ASME)
titleThermal Stresses in Elastic Plates With Elliptic Holes
typeJournal Paper
journal volume96
journal issue3
journal titleJournal of Manufacturing Science and Engineering
identifier doi10.1115/1.3438448
journal fristpage827
journal lastpage832
identifier eissn1528-8935
keywordsTemperature
keywordsHeat conduction
keywordsStress
keywordsThermal stresses
keywordsBoundary-value problems
keywordsElastic plates
keywordsEquations
keywordsMembranes
keywordsSteady state AND Temperature distribution
treeJournal of Manufacturing Science and Engineering:;1974:;volume( 096 ):;issue: 003
contenttypeFulltext


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