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    Electrohydrodynamic Conduction Pumping Driven Liquid Film Flow Boiling on Bare and Nanofiber Enhanced Surfaces

    Source: Journal of Heat Transfer:;2016:;volume( 138 ):;issue: 004::page 41501
    Author:
    Patel, Viral K.
    ,
    Seyed
    ,
    Sinha
    ,
    Sinha
    ,
    Yarin, Alexander
    DOI: 10.1115/1.4032021
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Liquid film flow boiling heat transfer driven by electrohydrodynamic (EHD) conduction pumping is experimentally studied on a surface with a novel metalplated nanofibermat coating. The nanotextured surface is formed on a copper substrate covered by an electrospun polymer nanofiber mat, which is copperplated as a postprocess. The mat has a thickness of about 30 خ¼m and is immersed in saturated HCFC123. The objective is to study electrowetting of the copperplated nanofiberenhanced surface via EHD conduction pumping mechanism for the entire liquid film flow boiling regime leading up to critical heat flux (CHF), and compare it to the bare surface without EHDdriven flow. The results show that with the combination of these two techniques, for a given superheat value, enhancement in heat flux and boiling heat transfer coefficient is as high as 555% compared to the bare surface. The results are quite promising for thermal management applications.
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      Electrohydrodynamic Conduction Pumping Driven Liquid Film Flow Boiling on Bare and Nanofiber Enhanced Surfaces

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/161528
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    contributor authorPatel, Viral K.
    contributor authorSeyed
    contributor authorSinha
    contributor authorSinha
    contributor authorYarin, Alexander
    date accessioned2017-05-09T01:30:08Z
    date available2017-05-09T01:30:08Z
    date issued2016
    identifier issn0022-1481
    identifier otherht_138_04_041501.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/161528
    description abstractLiquid film flow boiling heat transfer driven by electrohydrodynamic (EHD) conduction pumping is experimentally studied on a surface with a novel metalplated nanofibermat coating. The nanotextured surface is formed on a copper substrate covered by an electrospun polymer nanofiber mat, which is copperplated as a postprocess. The mat has a thickness of about 30 خ¼m and is immersed in saturated HCFC123. The objective is to study electrowetting of the copperplated nanofiberenhanced surface via EHD conduction pumping mechanism for the entire liquid film flow boiling regime leading up to critical heat flux (CHF), and compare it to the bare surface without EHDdriven flow. The results show that with the combination of these two techniques, for a given superheat value, enhancement in heat flux and boiling heat transfer coefficient is as high as 555% compared to the bare surface. The results are quite promising for thermal management applications.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleElectrohydrodynamic Conduction Pumping Driven Liquid Film Flow Boiling on Bare and Nanofiber Enhanced Surfaces
    typeJournal Paper
    journal volume138
    journal issue4
    journal titleJournal of Heat Transfer
    identifier doi10.1115/1.4032021
    journal fristpage41501
    journal lastpage41501
    identifier eissn1528-8943
    treeJournal of Heat Transfer:;2016:;volume( 138 ):;issue: 004
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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