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contributor authorPatel, Viral K.
contributor authorSeyed
contributor authorSinha
contributor authorSinha
contributor authorYarin, Alexander
date accessioned2017-05-09T01:30:08Z
date available2017-05-09T01:30:08Z
date issued2016
identifier issn0022-1481
identifier otherht_138_04_041501.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/161528
description abstractLiquid film flow boiling heat transfer driven by electrohydrodynamic (EHD) conduction pumping is experimentally studied on a surface with a novel metalplated nanofibermat coating. The nanotextured surface is formed on a copper substrate covered by an electrospun polymer nanofiber mat, which is copperplated as a postprocess. The mat has a thickness of about 30 خ¼m and is immersed in saturated HCFC123. The objective is to study electrowetting of the copperplated nanofiberenhanced surface via EHD conduction pumping mechanism for the entire liquid film flow boiling regime leading up to critical heat flux (CHF), and compare it to the bare surface without EHDdriven flow. The results show that with the combination of these two techniques, for a given superheat value, enhancement in heat flux and boiling heat transfer coefficient is as high as 555% compared to the bare surface. The results are quite promising for thermal management applications.
publisherThe American Society of Mechanical Engineers (ASME)
titleElectrohydrodynamic Conduction Pumping Driven Liquid Film Flow Boiling on Bare and Nanofiber Enhanced Surfaces
typeJournal Paper
journal volume138
journal issue4
journal titleJournal of Heat Transfer
identifier doi10.1115/1.4032021
journal fristpage41501
journal lastpage41501
identifier eissn1528-8943
treeJournal of Heat Transfer:;2016:;volume( 138 ):;issue: 004
contenttypeFulltext


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