| contributor author | Ansari, Danish | |
| contributor author | Kim, Kwang | |
| date accessioned | 2017-05-09T01:27:32Z | |
| date available | 2017-05-09T01:27:32Z | |
| date issued | 2016 | |
| identifier issn | 1528-9044 | |
| identifier other | fe_138_11_111301.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/160826 | |
| description abstract | The performances of various transverseflow doublelayer microchannel heat sink configurations were evaluated compared to those of parallelflow heat sink configurations via conjugate heat transfer analysis. For the analysis, threedimensional Navier–Stokes and energy equations for steady incompressible laminar flow were solved using a finitevolume solver. Water with temperaturedependent thermophysical properties was used as a coolant. The thermal resistances were evaluated for various flow configurations of both crosschannel and parallelchannel designs with identical geometric parameters and total flow rate. Changes in the microchannel flow direction lead to remarkable changes in thermal resistance and temperature uniformity. A transverseflow configuration exhibited the best overall performance among the tested flow configurations in terms of the thermal resistance, temperature uniformity, and pressure drop. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Double Layer Microchannel Heat Sinks With Transverse Flow Configurations | |
| type | Journal Paper | |
| journal volume | 138 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.4033558 | |
| journal fristpage | 31005 | |
| journal lastpage | 31005 | |
| identifier eissn | 1043-7398 | |
| tree | Journal of Electronic Packaging:;2016:;volume( 138 ):;issue: 003 | |
| contenttype | Fulltext | |
