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contributor authorLing, J. H. L.
contributor authorTay, A. A. O.
date accessioned2017-05-09T01:16:54Z
date available2017-05-09T01:16:54Z
date issued2015
identifier issn1528-9044
identifier otherep_137_01_014502.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/157669
description abstractAll current analytical methods for calculating junction temperature of field effect transistor (FET) and monolithic microwave integrated circuits (MMIC) devices have assumed a constant uniform temperature at the base of the substrate. In a packaged device, however, where the substrate is attached to a carrier, finite element thermal analyses have shown that the temperature distribution along the base of the substrate is not uniform but has a bellshaped distribution. Consequently, current analytical methods which attempt to predict the junction temperature of a packaged MMIC device by assuming a constant uniform temperature at the base of the substrate have been found to be inaccurate. In this paper, it is found that the temperature distribution along the base of a substrate can be well approximated by a Lorentz distribution which can be determined from a few basic parameters of the device such as the gate length, gate pitch, number of gates, and length of substrate. By incorporating this Lorentz temperature distribution at the base of the substrate with a new closedform solution for the threedimensional temperature distribution within the substrate, a new analytical method is developed for accurately calculating the junction temperature of MMIC devices. The accuracy of this new method has been verified with junction temperatures of MMIC devices measured using thermoreflectance thermography (TRT) as well as those calculated using finite element analysis (FEA).
publisherThe American Society of Mechanical Engineers (ASME)
titleA New Analytical Method for Calculating Maximum Junction Temperature of Packaged Devices Incorporating the Temperature Distribution at the Base of the Substrate
typeJournal Paper
journal volume137
journal issue1
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.4028120
journal fristpage14502
journal lastpage14502
identifier eissn1043-7398
treeJournal of Electronic Packaging:;2015:;volume( 137 ):;issue: 001
contenttypeFulltext


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