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contributor authorSullivan, Owen
contributor authorGupta, Man Prakash
contributor authorMukhopadhyay, Saibal
contributor authorKumar, Satish
date accessioned2017-05-09T01:16:53Z
date available2017-05-09T01:16:53Z
date issued2015
identifier issn1528-9044
identifier otherep_137_01_011005.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/157662
description abstractThermoelectric generators (TEGs) can significantly improve the net power consumption and battery life of the low power mobile devices or high performance devices by generating power from their waste heat. Recent advancements also show that the ultrathin thermoelectric devices can be fabricated and integrated within a microelectronic package. This work investigates the power generation by an ultrathin TEG embedded within a microelectronic package considering several key parameters such as load resistance, chip heat flux, and proximity of the TEG to chip. The analysis shows that the power generation from TEGs increases with increasing background heat flux on chip or when TEGs are moved closer to the chip. An array of embedded TEGs is considered in order to analyze the influence of multiple TEGs on total power generation and conversion efficiency. Increasing the number of TEGs from one to nine increases the useful power generation from 72.9 mW to 378.4 mW but decreases the average conversion efficiency from 0.47% to 0.32%. The average power generated per TEG gradually decrease from 72.9 mW to 42.0 mW when number of TEGs is increased from one to nine, but the total useful power generated using nine TEGs is significant and emphasize the benefits of using embedded TEGs to reduce net power consumption in electronics packages.
publisherThe American Society of Mechanical Engineers (ASME)
titleOn Chip Power Generation Using Ultrathin Thermoelectric Generators
typeJournal Paper
journal volume137
journal issue1
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.4027995
journal fristpage11005
journal lastpage11005
identifier eissn1043-7398
treeJournal of Electronic Packaging:;2015:;volume( 137 ):;issue: 001
contenttypeFulltext


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