contributor author | Chao, Ion | |
contributor author | Pan, Liang | |
contributor author | Sun, Cheng | |
contributor author | Zhang, Xiang | |
contributor author | Lavine, Adrienne S. | |
date accessioned | 2017-05-09T01:11:30Z | |
date available | 2017-05-09T01:11:30Z | |
date issued | 2014 | |
identifier issn | 2166-0468 | |
identifier other | jmnm_002_03_031003.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/156003 | |
description abstract | Plasmonic lithography may become a mainstream nanofabrication technique in the future. Experimental results show that feature size with 22 nm resolution can be achieved by plasmonic lithography. In the experiment, a plasmonic lens (PL) is used to focus the laser energy with resolution much higher than the diffraction limit and features are created in the thermally sensitive phasechange material (PCM) layer. The energy transport mechanisms are still not fully understood in the lithography process. In order to predict the lithography resolution and explore the energy transport mechanisms involved in the process, customized electromagnetic wave (EMW) and heat transfer (HT) models were developed in comsol. Parametric studies on both operating parameters and material properties were performed to optimize the lithography process. The parametric studies show that the lithography process can be improved by either reducing the thickness of the phasechange material layer or using a material with smaller real refractive index for that layer. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | A Coupled Electromagnetic and Thermal Model for Picosecond and Nanometer Scale Plasmonic Lithography Process | |
type | Journal Paper | |
journal volume | 2 | |
journal issue | 3 | |
journal title | Journal of Micro and Nano | |
identifier doi | 10.1115/1.4027589 | |
journal fristpage | 31003 | |
journal lastpage | 31003 | |
identifier eissn | 1932-619X | |
tree | Journal of Micro and Nano-Manufacturing:;2014:;volume( 002 ):;issue: 003 | |
contenttype | Fulltext | |