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    ArF Excimer Laser Micromachining of MEMS Materials: Characterization and Applications

    Source: Journal of Micro and Nano-Manufacturing:;2014:;volume( 002 ):;issue: 002::page 21006
    Author:
    Liu, Kewei
    ,
    Kim, Yoontae
    ,
    Noh, Hongseok (Moses)
    DOI: 10.1115/1.4027121
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Excimer laser ablation is a versatile technique that can be used for a variety of different materials. Excimer laser ablation overcomes limitations of conventional twodimensional (2D) microfabrication techniques and facilitates threedimensional (3D) micromanufacturing. Previously, we have reported a characterization study on 248 nm KrF excimer laser micromachining. This paper extends the study to 193 nm ArF excimer laser micromachining on five representative microelectromechanical systems (MEMS) materials (Si, sodalime glass, SU8, polydimethylsiloxane (PDMS), and polyimide). Relations between laser parameters (fluence, frequency and number of laser pulses) and etch performances (etch rates, aspect ratio, and surface quality) were investigated. Etch rate per shot was proportional to laser fluence but inversely proportional to number of laser pulses. Laser frequency did not show a notable impact on etch rates. Aspect ratio was also proportional to laser fluence and number of laser pulses but was not affected by laser frequency. Materials absorbance spectrum was found to have important influence on etch rates. Thermal modeling was conducted as well using numerical simulation to investigate how the photothermal ablation mechanism affects the etching results. Thermal properties of material, primarily thermal conductivity, were proved to have significant influence on etching results. Physical deformation in laser machined sites was also investigated using scanning electron microscopy (SEM) imaging. Element composition of redeposited materials around ablation site was analyzed using energy dispersive xray spectroscopy (EDXS) analysis. Combined with our previous report on KrF excimer laser micromachining, this comprehensive characterization study provides guidelines to identify optimized laser ablation parameters for desired microscale structures on MEMS materials. In order to demonstrate the 3D microfabrication capability of ArF excimer laser, cutting and local removal of insulation for a novel floating braided neural probe made of polyimide and nichrome was conducted successfully using the optimized laser ablation parameters obtained in the current study.
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      ArF Excimer Laser Micromachining of MEMS Materials: Characterization and Applications

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    http://yetl.yabesh.ir/yetl1/handle/yetl/155994
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    contributor authorLiu, Kewei
    contributor authorKim, Yoontae
    contributor authorNoh, Hongseok (Moses)
    date accessioned2017-05-09T01:11:28Z
    date available2017-05-09T01:11:28Z
    date issued2014
    identifier issn2166-0468
    identifier otherjmnm_002_02_021006.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/155994
    description abstractExcimer laser ablation is a versatile technique that can be used for a variety of different materials. Excimer laser ablation overcomes limitations of conventional twodimensional (2D) microfabrication techniques and facilitates threedimensional (3D) micromanufacturing. Previously, we have reported a characterization study on 248 nm KrF excimer laser micromachining. This paper extends the study to 193 nm ArF excimer laser micromachining on five representative microelectromechanical systems (MEMS) materials (Si, sodalime glass, SU8, polydimethylsiloxane (PDMS), and polyimide). Relations between laser parameters (fluence, frequency and number of laser pulses) and etch performances (etch rates, aspect ratio, and surface quality) were investigated. Etch rate per shot was proportional to laser fluence but inversely proportional to number of laser pulses. Laser frequency did not show a notable impact on etch rates. Aspect ratio was also proportional to laser fluence and number of laser pulses but was not affected by laser frequency. Materials absorbance spectrum was found to have important influence on etch rates. Thermal modeling was conducted as well using numerical simulation to investigate how the photothermal ablation mechanism affects the etching results. Thermal properties of material, primarily thermal conductivity, were proved to have significant influence on etching results. Physical deformation in laser machined sites was also investigated using scanning electron microscopy (SEM) imaging. Element composition of redeposited materials around ablation site was analyzed using energy dispersive xray spectroscopy (EDXS) analysis. Combined with our previous report on KrF excimer laser micromachining, this comprehensive characterization study provides guidelines to identify optimized laser ablation parameters for desired microscale structures on MEMS materials. In order to demonstrate the 3D microfabrication capability of ArF excimer laser, cutting and local removal of insulation for a novel floating braided neural probe made of polyimide and nichrome was conducted successfully using the optimized laser ablation parameters obtained in the current study.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleArF Excimer Laser Micromachining of MEMS Materials: Characterization and Applications
    typeJournal Paper
    journal volume2
    journal issue2
    journal titleJournal of Micro and Nano
    identifier doi10.1115/1.4027121
    journal fristpage21006
    journal lastpage21006
    identifier eissn1932-619X
    treeJournal of Micro and Nano-Manufacturing:;2014:;volume( 002 ):;issue: 002
    contenttypeFulltext
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