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contributor authorJaeger, Richard C.
contributor authorMotalab, Mohammad
contributor authorHussain, Safina
contributor authorSuhling, Jeffrey C.
date accessioned2017-05-09T01:06:55Z
date available2017-05-09T01:06:55Z
date issued2014
identifier issn1528-9044
identifier otherep_136_04_041014.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/154508
description abstractUnder the proper orientations and excitations, the transverse output of rotationally symmetric fourcontact van der Pauw (VDP) stress sensors depends upon only the inplane shear stress or the difference of the inplane normal stresses on (100) silicon. In bridgemode, each sensor requires only one fourwire measurement and produces an output voltage with a sensitivity that is 3.16 times that of the equivalent resistor rosettes or bridges, just as in the normal VDP sensor mode that requires two separate measurements. Both numerical and experimental results are presented to validate the conjectured behavior of the sensor. Similar results apply to sensors on (111) silicon. The output voltage results provide a simple mathematical expression for the offset voltage in Hall effect devices or the response of pseudo Halleffect sensors. Bridge operation facilitates use of the VDP structure in embedded stress sensors in integrated circuits.
publisherThe American Society of Mechanical Engineers (ASME)
titleFour Wire Bridge Measurements of Silicon van der Pauw Stress Sensors
typeJournal Paper
journal volume136
journal issue4
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.4028333
journal fristpage41014
journal lastpage41014
identifier eissn1043-7398
treeJournal of Electronic Packaging:;2014:;volume( 136 ):;issue: 004
contenttypeFulltext


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