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contributor authorLall, Pradeep
contributor authorLowe, Ryan
date accessioned2017-05-09T01:06:55Z
date available2017-05-09T01:06:55Z
date issued2014
identifier issn1528-9044
identifier otherep_136_04_041013.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/154507
description abstractThis paper compares three prognostic algorithms applied to the same data recorded during the failure of a solder joint in ball grid array component attached to a printed circuit board. The objective is to expand on the relative strengths and weaknesses of each proposed algorithm. Emphasis will be placed on highlighting differences in underlying assumptions required for each algorithm, details of remaining useful life calculations, and methods of uncertainty quantification. Metrics tailored specifically for prognostic health monitoring (PHM) are presented to characterize the performance of predictions. The relative merits of PHM algorithms based on a Kalman filter, extended Kalman filter, and a particle filter all demonstrated on the same data set will be discussed. The paper concludes by discussing which algorithm performs best given the information available about the system being monitored.
publisherThe American Society of Mechanical Engineers (ASME)
titleComparison of Prognostic Health Management Algorithms for Assessment of Electronic Interconnect Reliability Under Vibration
typeJournal Paper
journal volume136
journal issue4
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.4028163
journal fristpage41013
journal lastpage41013
identifier eissn1043-7398
treeJournal of Electronic Packaging:;2014:;volume( 136 ):;issue: 004
contenttypeFulltext


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