Show simple item record

contributor authorHao, Xiaohong
contributor authorPeng, Bei
contributor authorXie, Gongnan
contributor authorChen, Yi
date accessioned2017-05-09T01:06:50Z
date available2017-05-09T01:06:50Z
date issued2014
identifier issn1528-9044
identifier otherep_136_03_031009.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/154481
description abstractIn this paper, a thermal resistance network analytical model is proposed to investigate the thermal resistance and pressure drop in serpentine channel heat sinks with 180 deg bends. The total thermal resistance is obtained using a thermal resistance network model based on the equivalent thermal circuit method. Pressure drop is derived considering straight channel and bend loss because the bends interrupt the hydrodynamic boundary periodically. Considering the effects of laminar flow development and redevelopment, the bend loss coefficient is obtained as a function of the Reynolds number, aspect ratios, widths of fins, and turn clearances, through a threeregime correlation. The model is then experimentally validated by measuring the temperature and pressure characteristics of heat sinks with different Reynolds numbers and different geometric parameters. Finally, the temperaturerise and pressure distribution of the thermal fluid with Reynolds numbers of 500, 1000, and 1500 are examined utilizing this model.
publisherThe American Society of Mechanical Engineers (ASME)
titleThermal Analysis and Experimental Validation of Laminar Heat Transfer and Pressure Drop in Serpentine Channel Heat Sinks for Electronic Cooling
typeJournal Paper
journal volume136
journal issue3
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.4027508
journal fristpage31009
journal lastpage31009
identifier eissn1043-7398
treeJournal of Electronic Packaging:;2014:;volume( 136 ):;issue: 003
contenttypeFulltext


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record