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contributor authorJie Liu, Jun
contributor authorZhang, Hua
contributor authorYao, S. C.
contributor authorLi, Yubai
date accessioned2017-05-09T01:06:48Z
date available2017-05-09T01:06:48Z
date issued2014
identifier issn1528-9044
identifier otherep_136_02_021008.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/154466
description abstractCompared to singlephase heat transfer, twophase microchannel heat sinks utilize latent heat to reduce the needed flow rate and to maintain a rather uniform temperature close to the boiling temperature. The challenge in the application of cooling for electronic chips is the necessity of modeling a large number of microchannels using large number of meshes and extensive computation time. In the present study, a modified porous media method modeling of twophase flow in microchannels is performed. Compared with conjugate method, which considers individual channels and walls, it saves computation effort and provides a more convenient means to perform optimization of channel geometry. The porous media simulation is applied to a real chip. The channels of high heat load will have higher qualities, larger flow resistances, and lower flow rates. At a constant available pressure drop over the channels, the low heat load channels show much higher mass flow rates than needed. To avoid this flow maldistribution, the channel widths on a chip are adjusted to ensure that the exit qualities and mass flow rate of channels are more uniform. As a result, the total flow rate on the chip is drastically reduced, and the temperature gradient is also minimized. However, it only gives a relatively small reduction on the maximum surface temperature of chip.
publisherThe American Society of Mechanical Engineers (ASME)
titlePorous Media Modeling of Two Phase Microchannel Cooling of Electronic Chips With Nonuniform Power Distribution
typeJournal Paper
journal volume136
journal issue2
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.4027420
journal fristpage21008
journal lastpage21008
identifier eissn1043-7398
treeJournal of Electronic Packaging:;2014:;volume( 136 ):;issue: 002
contenttypeFulltext


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