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contributor authorLee, Sangil
contributor authorBaldwin, Daniel F.
date accessioned2017-05-09T01:06:45Z
date available2017-05-09T01:06:45Z
date issued2014
identifier issn1528-9044
identifier otherep_136_01_011005.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/154446
description abstractNoflow underfill process has exhibited a narrow feasible process window due to electrical assembly yield loss or underfill voiding. In general, the assembly yield can be improved using reflow process designed at high temperature, while the high temperature condition potentially causes serious underfill voiding. Typically, the underfill voiding can result in critical defects, such as solders fatigue cracking or solders bridge, causing early failures in thermal reliability. Therefore, this study reviews a classical bubble nucleation theory to model voids nucleation during reflow process. The established model designed a reflow process possibly preventing underfill voiding. The reflow process was validated using systematic experiments designed on the theoretical study with a commercial high I/O counts (5000>), finepitch (<150 خ¼m) flip chip. The theoretical model exhibits good agreement with experimental results. Thus, this paper presents systematic studies through the use of structured experimentation designed to achieve a high, stable yield, and voidfree assembly process on the classical bubble nucleation theory.
publisherThe American Society of Mechanical Engineers (ASME)
titleHeterogeneous Void Nucleation Study in Flip Chip Assembly Process Using No Flow Underfill
typeJournal Paper
journal volume136
journal issue1
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.4026164
journal fristpage11005
journal lastpage11005
identifier eissn1043-7398
treeJournal of Electronic Packaging:;2014:;volume( 136 ):;issue: 001
contenttypeFulltext


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