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contributor authorYang, Chaoran
contributor authorSong, Fubin
contributor authorRicky Lee, S. W.
date accessioned2017-05-09T01:06:44Z
date available2017-05-09T01:06:44Z
date issued2014
identifier issn1528-9044
identifier otherep_136_01_011003.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/154443
description abstractSnCuNi is one of the most common ternary intermetallic compounds formed in the Snbased solder joint, and its formation and properties can be greatly influenced by the amount of Ni. Ni can participate in the interfacial reaction and diffuse into the intermetallic compound layer from either the solder or from the pad. In this research, comparative studies of different SnCuNi intermetallic compounds were conducted using two kinds of SnCuNi solders with organic solderability preservatives pad finish and a SnCu solder with electroless nickel/immersion gold pad finish. In the former case, Ni can only diffuse into the intermetallic compound from the solder matrix, while in the latter the Ni is only from the metallization layer on the Cu base. Scanning electron microscopy and transmission electron microscopy were employed to inspect the morphologies and interfacial microstructures of the intermetallic compounds. The thermal aging test was conducted to investigate their growth behavior under elevated temperature conditions. Mechanical strength after different aging hours was also evaluated via high speed ball pull test.
publisherThe American Society of Mechanical Engineers (ASME)
titleComparison of Ball Pull Strength Among Various Sn Cu Ni Solder Joints With Different Pad Surface Finishes
typeJournal Paper
journal volume136
journal issue1
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.4025915
journal fristpage11003
journal lastpage11003
identifier eissn1043-7398
treeJournal of Electronic Packaging:;2014:;volume( 136 ):;issue: 001
contenttypeFulltext


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