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    Mechanics Design for Stretchable, High Areal Coverage GaAs Solar Module on an Ultrathin Substrate

    Source: Journal of Applied Mechanics:;2014:;volume( 081 ):;issue: 012::page 124502
    Author:
    Shi, Xiaoting
    ,
    Xu, Renxiao
    ,
    Li, Yuhang
    ,
    Zhang, Yihui
    ,
    Ren, Zhigang
    ,
    Gu, Jianfeng
    ,
    Rogers, John A.
    ,
    Huang, Yonggang
    DOI: 10.1115/1.4028977
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The trench design of substrate together with curvy interconnect formed from buckling provides a solution to stretchable electronics with high areal coverage on an ultrathin substrate, which are critically important for stretchable photovoltaics. In this paper, an improved trench design is proposed and verified by finite element analysis (FEA), through use of a heterogeneous design, to facilitate strain isolation and avoid possible fracture/delamination issue. A serpentine design of interconnect is also devised to offer ∼440% interconnect level stretchability, which is >3.5 times that of previous trench design, and could transform into 20% systemlevel stretchability, even for areal coverage as high as ∼90%.
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      Mechanics Design for Stretchable, High Areal Coverage GaAs Solar Module on an Ultrathin Substrate

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/153914
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    • Journal of Applied Mechanics

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    contributor authorShi, Xiaoting
    contributor authorXu, Renxiao
    contributor authorLi, Yuhang
    contributor authorZhang, Yihui
    contributor authorRen, Zhigang
    contributor authorGu, Jianfeng
    contributor authorRogers, John A.
    contributor authorHuang, Yonggang
    date accessioned2017-05-09T01:05:05Z
    date available2017-05-09T01:05:05Z
    date issued2014
    identifier issn0021-8936
    identifier otherjam_081_12_124502.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/153914
    description abstractThe trench design of substrate together with curvy interconnect formed from buckling provides a solution to stretchable electronics with high areal coverage on an ultrathin substrate, which are critically important for stretchable photovoltaics. In this paper, an improved trench design is proposed and verified by finite element analysis (FEA), through use of a heterogeneous design, to facilitate strain isolation and avoid possible fracture/delamination issue. A serpentine design of interconnect is also devised to offer ∼440% interconnect level stretchability, which is >3.5 times that of previous trench design, and could transform into 20% systemlevel stretchability, even for areal coverage as high as ∼90%.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleMechanics Design for Stretchable, High Areal Coverage GaAs Solar Module on an Ultrathin Substrate
    typeJournal Paper
    journal volume81
    journal issue12
    journal titleJournal of Applied Mechanics
    identifier doi10.1115/1.4028977
    journal fristpage124502
    journal lastpage124502
    identifier eissn1528-9036
    treeJournal of Applied Mechanics:;2014:;volume( 081 ):;issue: 012
    contenttypeFulltext
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