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    Mechanics of Interfacial Delamination in Epidermal Electronics Systems

    Source: Journal of Applied Mechanics:;2014:;volume( 081 ):;issue: 004::page 44501
    Author:
    Cheng, Huanyu
    ,
    Wang, Shuodao
    DOI: 10.1115/1.4025305
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In order to provide continuous diagnostic and therapeutic options that exploit electrophysiological signals from the epidermis, this study discusses epidermal electronics systems (EES) that conform to the skin surface via van der Waals force alone, which is otherwise susceptible to artifacts associated with motioninduced changes. This paper not only establishes a criterion of conformal contact between the EES and the skin for both initial contact and the case where the skin is subject to external loading but also investigates the criterion to prevent any partial delamination between electronics and the skin. These results improve the performance of EES by maximizing intimate contact between the EES and skin, revealing important underlying physical insights for device optimization and future design.
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      Mechanics of Interfacial Delamination in Epidermal Electronics Systems

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    contributor authorCheng, Huanyu
    contributor authorWang, Shuodao
    date accessioned2017-05-09T01:04:48Z
    date available2017-05-09T01:04:48Z
    date issued2014
    identifier issn0021-8936
    identifier otherjam_081_04_044501.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/153804
    description abstractIn order to provide continuous diagnostic and therapeutic options that exploit electrophysiological signals from the epidermis, this study discusses epidermal electronics systems (EES) that conform to the skin surface via van der Waals force alone, which is otherwise susceptible to artifacts associated with motioninduced changes. This paper not only establishes a criterion of conformal contact between the EES and the skin for both initial contact and the case where the skin is subject to external loading but also investigates the criterion to prevent any partial delamination between electronics and the skin. These results improve the performance of EES by maximizing intimate contact between the EES and skin, revealing important underlying physical insights for device optimization and future design.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleMechanics of Interfacial Delamination in Epidermal Electronics Systems
    typeJournal Paper
    journal volume81
    journal issue4
    journal titleJournal of Applied Mechanics
    identifier doi10.1115/1.4025305
    journal fristpage44501
    journal lastpage44501
    identifier eissn1528-9036
    treeJournal of Applied Mechanics:;2014:;volume( 081 ):;issue: 004
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian