YaBeSH Engineering and Technology Library

    • Journals
    • PaperQuest
    • YSE Standards
    • YaBeSH
    • Login
    View Item 
    •   YE&T Library
    • ASME
    • Journal of Thermal Science and Engineering Applications
    • View Item
    •   YE&T Library
    • ASME
    • Journal of Thermal Science and Engineering Applications
    • View Item
    • All Fields
    • Source Title
    • Year
    • Publisher
    • Title
    • Subject
    • Author
    • DOI
    • ISBN
    Advanced Search
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Archive

    Analysis of Parallel Microchannels for Flow Control and Hot Spot Cooling

    Source: Journal of Thermal Science and Engineering Applications:;2013:;volume( 005 ):;issue: 004::page 41007
    Author:
    Solovitz, Stephen A.
    DOI: 10.1115/1.4024021
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Microchannel heat transfer is commonly applied in the thermal management of highpower electronics. Most designs involve a series of parallel microchannels, which are typically analyzed by assuming a uniform flow distribution. However, many devices have a nonuniform thermal distribution, with hot spots producing much higher heat fluxes and temperatures than the baseline. Although solutions have been developed to improve local heat transfer, these are advanced methods using embedded cooling devices. As an alternative, a passive solution is developed here using analytical methods to optimize the channel geometry for a desired, nonuniform flow distribution. This results in a simple power law for the passage diameter, which may be useful for many microfluidic systems, including electronics cooling devices. Computational simulations are then applied to demonstrate the effectiveness of the power law for laminar conditions. At low Reynolds numbers, the flow distribution can be controlled to good accuracy, matching the desired distribution to within less than 1%. Further simulations consider the control of hot spots in laminar developing flow. Under these circumstances, temperatures can be made uniform to within 2 آ°C over a range of Reynolds numbers (60 to 300), demonstrating the capability of this power law solution.
    • Download: (1.223Mb)
    • Show Full MetaData Hide Full MetaData
    • Get RIS
    • Item Order
    • Go To Publisher
    • Price: 5000 Rial
    • Statistics

      Analysis of Parallel Microchannels for Flow Control and Hot Spot Cooling

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/153258
    Collections
    • Journal of Thermal Science and Engineering Applications

    Show full item record

    contributor authorSolovitz, Stephen A.
    date accessioned2017-05-09T01:02:55Z
    date available2017-05-09T01:02:55Z
    date issued2013
    identifier issn1948-5085
    identifier othertsea_005_04_041007.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/153258
    description abstractMicrochannel heat transfer is commonly applied in the thermal management of highpower electronics. Most designs involve a series of parallel microchannels, which are typically analyzed by assuming a uniform flow distribution. However, many devices have a nonuniform thermal distribution, with hot spots producing much higher heat fluxes and temperatures than the baseline. Although solutions have been developed to improve local heat transfer, these are advanced methods using embedded cooling devices. As an alternative, a passive solution is developed here using analytical methods to optimize the channel geometry for a desired, nonuniform flow distribution. This results in a simple power law for the passage diameter, which may be useful for many microfluidic systems, including electronics cooling devices. Computational simulations are then applied to demonstrate the effectiveness of the power law for laminar conditions. At low Reynolds numbers, the flow distribution can be controlled to good accuracy, matching the desired distribution to within less than 1%. Further simulations consider the control of hot spots in laminar developing flow. Under these circumstances, temperatures can be made uniform to within 2 آ°C over a range of Reynolds numbers (60 to 300), demonstrating the capability of this power law solution.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleAnalysis of Parallel Microchannels for Flow Control and Hot Spot Cooling
    typeJournal Paper
    journal volume5
    journal issue4
    journal titleJournal of Thermal Science and Engineering Applications
    identifier doi10.1115/1.4024021
    journal fristpage41007
    journal lastpage41007
    identifier eissn1948-5093
    treeJournal of Thermal Science and Engineering Applications:;2013:;volume( 005 ):;issue: 004
    contenttypeFulltext
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian