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    Diffusion Welded Microchannel Heat Exchanger for Industrial Processes

    Source: Journal of Thermal Science and Engineering Applications:;2013:;volume( 005 ):;issue: 001::page 11009
    Author:
    Sabharwall, Piyush
    ,
    Clark, Denis E.
    ,
    Mizia, Ronald E.
    ,
    Glazoff, Michael V.
    ,
    McKellar, Michael G.
    DOI: 10.1115/1.4007578
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The goal of next generation reactors is to increase energy efficiency in the production of electricity and provide hightemperature heat for industrial processes. The efficient transfer of energy for industrial applications depends on the ability to incorporate effective heat exchangers between the nuclear heat transport system and the industrial process. The need for efficiency, compactness, and safety challenge the boundaries of existing heat exchanger technology. Various studies have been performed in attempts to update the secondary heat exchanger that is downstream of the primary heat exchanger, mostly because its performance is strongly tied to the ability to employ more efficient industrial processes. Modern compact heat exchangers can provide high compactness, a measure of the ratio of surface areatovolume of a heat exchange. The microchannel heat exchanger studied here is a platetype, robust heat exchanger that combines compactness, low pressure drop, high effectiveness, and the ability to operate with a very large pressure differential between hot and cold sides. The plates are etched and thereafter joined by diffusion welding, resulting in extremely strong allmetal heat exchanger cores. After bonding, any number of core blocks can be welded together to provide the required flow capacity. This study explores the microchannel heat exchanger and draws conclusions about diffusion welding/bonding for joining heat exchanger plates, with both experimental and computational modeling, along with existing challenges and gaps. Also, presented is a thermal design method for determining overall design specifications for a microchannel printed circuit heat exchanger for both supercritical (24 MPa) and subcritical (17 MPa) Rankine power cycles.
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      Diffusion Welded Microchannel Heat Exchanger for Industrial Processes

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    http://yetl.yabesh.ir/yetl1/handle/yetl/153221
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    contributor authorSabharwall, Piyush
    contributor authorClark, Denis E.
    contributor authorMizia, Ronald E.
    contributor authorGlazoff, Michael V.
    contributor authorMcKellar, Michael G.
    date accessioned2017-05-09T01:02:48Z
    date available2017-05-09T01:02:48Z
    date issued2013
    identifier issn1948-5085
    identifier othertsea_5_1_011009.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/153221
    description abstractThe goal of next generation reactors is to increase energy efficiency in the production of electricity and provide hightemperature heat for industrial processes. The efficient transfer of energy for industrial applications depends on the ability to incorporate effective heat exchangers between the nuclear heat transport system and the industrial process. The need for efficiency, compactness, and safety challenge the boundaries of existing heat exchanger technology. Various studies have been performed in attempts to update the secondary heat exchanger that is downstream of the primary heat exchanger, mostly because its performance is strongly tied to the ability to employ more efficient industrial processes. Modern compact heat exchangers can provide high compactness, a measure of the ratio of surface areatovolume of a heat exchange. The microchannel heat exchanger studied here is a platetype, robust heat exchanger that combines compactness, low pressure drop, high effectiveness, and the ability to operate with a very large pressure differential between hot and cold sides. The plates are etched and thereafter joined by diffusion welding, resulting in extremely strong allmetal heat exchanger cores. After bonding, any number of core blocks can be welded together to provide the required flow capacity. This study explores the microchannel heat exchanger and draws conclusions about diffusion welding/bonding for joining heat exchanger plates, with both experimental and computational modeling, along with existing challenges and gaps. Also, presented is a thermal design method for determining overall design specifications for a microchannel printed circuit heat exchanger for both supercritical (24 MPa) and subcritical (17 MPa) Rankine power cycles.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleDiffusion Welded Microchannel Heat Exchanger for Industrial Processes
    typeJournal Paper
    journal volume5
    journal issue1
    journal titleJournal of Thermal Science and Engineering Applications
    identifier doi10.1115/1.4007578
    journal fristpage11009
    journal lastpage11009
    identifier eissn1948-5093
    treeJournal of Thermal Science and Engineering Applications:;2013:;volume( 005 ):;issue: 001
    contenttypeFulltext
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