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    Analytical Solutions of Heat Transfer and Film Thickness in Thin Film Evaporation

    Source: Journal of Heat Transfer:;2013:;volume( 135 ):;issue: 003::page 31501
    Author:
    Yan, Chunji
    ,
    Ma, H. B.
    DOI: 10.1115/1.4007856
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A mathematical model predicting heat transfer and film thickness in thinfilm region is developed herein. Utilizing dimensionless analysis, analytical solutions have been obtained for heat flux distribution, total heat transfer rate per unit length, location of the maximum heat flux and ratio of conduction thermal resistance to convection thermal resistance in the evaporating film region. These analytical solutions show that the maximum dimensionless heat flux is constant which is independent of the superheat. Maximum total heat transfer rate is determined for a given film region. The ratio of conduction thermal resistance to convection thermal resistance is a function of dimensionless film thickness. This work will lead to a better understanding of heat transfer and fluid flow occurring in the evaporating film region.
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      Analytical Solutions of Heat Transfer and Film Thickness in Thin Film Evaporation

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    http://yetl.yabesh.ir/yetl1/handle/yetl/152028
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    contributor authorYan, Chunji
    contributor authorMa, H. B.
    date accessioned2017-05-09T00:59:31Z
    date available2017-05-09T00:59:31Z
    date issued2013
    identifier issn0022-1481
    identifier otherht_135_3_031501.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/152028
    description abstractA mathematical model predicting heat transfer and film thickness in thinfilm region is developed herein. Utilizing dimensionless analysis, analytical solutions have been obtained for heat flux distribution, total heat transfer rate per unit length, location of the maximum heat flux and ratio of conduction thermal resistance to convection thermal resistance in the evaporating film region. These analytical solutions show that the maximum dimensionless heat flux is constant which is independent of the superheat. Maximum total heat transfer rate is determined for a given film region. The ratio of conduction thermal resistance to convection thermal resistance is a function of dimensionless film thickness. This work will lead to a better understanding of heat transfer and fluid flow occurring in the evaporating film region.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleAnalytical Solutions of Heat Transfer and Film Thickness in Thin Film Evaporation
    typeJournal Paper
    journal volume135
    journal issue3
    journal titleJournal of Heat Transfer
    identifier doi10.1115/1.4007856
    journal fristpage31501
    journal lastpage31501
    identifier eissn1528-8943
    treeJournal of Heat Transfer:;2013:;volume( 135 ):;issue: 003
    contenttypeFulltext
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