| contributor author | Yan, Chunji | |
| contributor author | Ma, H. B. | |
| date accessioned | 2017-05-09T00:59:31Z | |
| date available | 2017-05-09T00:59:31Z | |
| date issued | 2013 | |
| identifier issn | 0022-1481 | |
| identifier other | ht_135_3_031501.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/152028 | |
| description abstract | A mathematical model predicting heat transfer and film thickness in thinfilm region is developed herein. Utilizing dimensionless analysis, analytical solutions have been obtained for heat flux distribution, total heat transfer rate per unit length, location of the maximum heat flux and ratio of conduction thermal resistance to convection thermal resistance in the evaporating film region. These analytical solutions show that the maximum dimensionless heat flux is constant which is independent of the superheat. Maximum total heat transfer rate is determined for a given film region. The ratio of conduction thermal resistance to convection thermal resistance is a function of dimensionless film thickness. This work will lead to a better understanding of heat transfer and fluid flow occurring in the evaporating film region. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Analytical Solutions of Heat Transfer and Film Thickness in Thin Film Evaporation | |
| type | Journal Paper | |
| journal volume | 135 | |
| journal issue | 3 | |
| journal title | Journal of Heat Transfer | |
| identifier doi | 10.1115/1.4007856 | |
| journal fristpage | 31501 | |
| journal lastpage | 31501 | |
| identifier eissn | 1528-8943 | |
| tree | Journal of Heat Transfer:;2013:;volume( 135 ):;issue: 003 | |
| contenttype | Fulltext | |