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contributor authorWang, Fuliang
contributor authorTang, Weidong
contributor authorLi, Junhui
contributor authorHan, Lei
date accessioned2017-05-09T00:57:45Z
date available2017-05-09T00:57:45Z
date issued2013
identifier issn1528-9044
identifier otherep_135_04_041004.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/151443
description abstractKinks have a strong influence on the structural performance of wire bonds. In this study, a variablelength linkspring model has been developed to better understand kink formation. In this model, a gold wire was decomposed into segments that were represented by a link and a torsional spring. One end of the gold wire was fixed, and the other end was free. The friction and air tension forces at the wire ends were considered a function of the capillary position, and the wire segments and moment balance equations were added at the free end as the wire length increased. By using this model, the wire profile, moment, and curvature diagrams at the reverse motion stage were obtained to study the dynamical kink formation and wirelength increasing processes. The analysis result was verified experimentally. Good agreement is obtained between the analytical and the experimental wire profiles. This study indicates that a moment magnitude of several hundred mNآ·خ¼m is required to form a kink, and the wire profile is the result of the residual curvature and the instantaneous bending moment.
publisherThe American Society of Mechanical Engineers (ASME)
titleVariable Length Link Spring Model for Kink Formation During Wire Bonding
typeJournal Paper
journal volume135
journal issue4
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.4025308
journal fristpage41004
journal lastpage41004
identifier eissn1043-7398
treeJournal of Electronic Packaging:;2013:;volume( 135 ):;issue: 004
contenttypeFulltext


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