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contributor authorNagarathinam, Srinarayana
contributor authorFakhim, Babak
contributor authorBehnia, Masud
contributor authorArmfield, Steve
date accessioned2017-05-09T00:57:42Z
date available2017-05-09T00:57:42Z
date issued2013
identifier issn1528-9044
identifier otherep_135_03_030905.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/151427
description abstractIt is well known that the flow distribution in data centers can be effected by a variety of parameters such as rack and computer room air conditioning (CRAC) positions, raisedfloor height, ceiling height, and percentage opening of perforated tiles. In the present paper, numerical simulations are conducted to optimize the layout of a raisedfloor data center with respect to these parameters. Two different approaches have been used: parametric optimization; and a multivariable approach using response surface optimization. In the parametric optimization procedure, the data center is optimized with respect to the maximum temperature in the room. While in the multivariable approach, a cost function is constructed from all the rack inlet temperatures and is minimized. The results show that the multivariable approach is computationally economical and the optimized layout gives a better thermal performance compared to that of parametric optimization.
publisherThe American Society of Mechanical Engineers (ASME)
titleA Comparison of Parametric and Multivariable Optimization Techniques in a Raised Floor Data Center
typeJournal Paper
journal volume135
journal issue3
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.4023214
journal fristpage30905
journal lastpage30905
identifier eissn1043-7398
treeJournal of Electronic Packaging:;2013:;volume( 135 ):;issue: 003
contenttypeFulltext


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