Show simple item record

contributor authorLe, Taoran
contributor authorLin, Ziyin
contributor authorVyas, Rushi
contributor authorLakafosis, Vasileios
contributor authorYang, Li
contributor authorTraille, Anya
contributor authorTentzeris, Manos M.
contributor authorWong, Ching
date accessioned2017-05-09T00:57:38Z
date available2017-05-09T00:57:38Z
date issued2013
identifier issn1528-9044
identifier otherep_135_1_011007.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/151404
description abstractWe discuss here the use of inkjet printing technology as an attractive alternative for the fabrication of radio frequency (RF) electronics. Inkjet printing is compared to widelyused traditional methods such as wet etching and mechanical milling with discussion of the advantages and potential disadvantages afforded by the technology. Next the paper presents the current state of the art for RF printed electronics, including fundamental fabrication technologies, methodologies, and materials. Included are detailed discussions of the fabrication of foundational conductive elements, integration of external elements via low temperature bonding techniques, and enhancement strategies focusing on the addition of novel materials. We then present some current challenges related to inkjet printing, along with some exciting recent advances in materials technology seeking to overcome the current limitations and to expand the frontier of the technology. Following are multiple examples detailing the successful use of inkjet printing methods in the creation of novel RF devices, providing proof of concept and illustrating in greater detail the concepts presented in the theoretical sections.
publisherThe American Society of Mechanical Engineers (ASME)
titleInkjet Printing of Radio Frequency Electronics: Design Methodologies and Application of Novel Nanotechnologies
typeJournal Paper
journal volume135
journal issue1
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.4023671
journal fristpage11007
journal lastpage11007
identifier eissn1043-7398
treeJournal of Electronic Packaging:;2013:;volume( 135 ):;issue: 001
contenttypeFulltext


Files in this item

Thumbnail

This item appears in the following Collection(s)

Show simple item record