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    Heat Transfer at Aluminum–Water Interfaces: Effect of Surface Roughness

    Source: Journal of Nanotechnology in Engineering and Medicine:;2012:;volume( 003 ):;issue: 003::page 31008
    Author:
    H. Sam Huang
    ,
    Vikas Varshney
    ,
    Jennifer L. Wohlwend
    ,
    Ajit K. Roy
    DOI: 10.1115/1.4007584
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: In this paper, we studied the effect of microscopic surface roughness on heat transfer between aluminum and water by molecular dynamic (MD) simulations and macroscopic surface roughness on heat transfer between aluminum and water by finite element (FE) method. It was observed that as the microscopic scale surface roughness increases, the thermal boundary conductance increases. At the macroscopic scale, different degrees of surface roughness were studied by finite element method. The heat transfer was observed to enhance as the surface roughness increases. Based on the studies of thermal boundary conductance as a function of system size at the molecular level, a procedure was proposed to obtain the thermal boundary conductance at the mesoscopic scale. The thermal boundary resistance at the microscopic scale obtained by MD simulations and the thermal boundary resistance at the mesoscopic scale obtained by the extrapolation procedure can be included and implemented at the interfacial elements in the finite element method at the macroscopic scale. This provides us a useful model, in which different scales of surface roughness can be included, for heat transfer analysis.
    keyword(s): Heat transfer , Aluminum , Surface roughness , Electrical conductance , Water , Interfacial thermal resistance , Engineering simulation , Molecular dynamics simulation , Thermal conductivity AND Finite element methods ,
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      Heat Transfer at Aluminum–Water Interfaces: Effect of Surface Roughness

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    http://yetl.yabesh.ir/yetl1/handle/yetl/149963
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    contributor authorH. Sam Huang
    contributor authorVikas Varshney
    contributor authorJennifer L. Wohlwend
    contributor authorAjit K. Roy
    date accessioned2017-05-09T00:53:40Z
    date available2017-05-09T00:53:40Z
    date copyright41122
    date issued2012
    identifier issn1949-2944
    identifier otherJNEMAA-926528#nano_3_3_031008.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/149963
    description abstractIn this paper, we studied the effect of microscopic surface roughness on heat transfer between aluminum and water by molecular dynamic (MD) simulations and macroscopic surface roughness on heat transfer between aluminum and water by finite element (FE) method. It was observed that as the microscopic scale surface roughness increases, the thermal boundary conductance increases. At the macroscopic scale, different degrees of surface roughness were studied by finite element method. The heat transfer was observed to enhance as the surface roughness increases. Based on the studies of thermal boundary conductance as a function of system size at the molecular level, a procedure was proposed to obtain the thermal boundary conductance at the mesoscopic scale. The thermal boundary resistance at the microscopic scale obtained by MD simulations and the thermal boundary resistance at the mesoscopic scale obtained by the extrapolation procedure can be included and implemented at the interfacial elements in the finite element method at the macroscopic scale. This provides us a useful model, in which different scales of surface roughness can be included, for heat transfer analysis.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleHeat Transfer at Aluminum–Water Interfaces: Effect of Surface Roughness
    typeJournal Paper
    journal volume3
    journal issue3
    journal titleJournal of Nanotechnology in Engineering and Medicine
    identifier doi10.1115/1.4007584
    journal fristpage31008
    identifier eissn1949-2952
    keywordsHeat transfer
    keywordsAluminum
    keywordsSurface roughness
    keywordsElectrical conductance
    keywordsWater
    keywordsInterfacial thermal resistance
    keywordsEngineering simulation
    keywordsMolecular dynamics simulation
    keywordsThermal conductivity AND Finite element methods
    treeJournal of Nanotechnology in Engineering and Medicine:;2012:;volume( 003 ):;issue: 003
    contenttypeFulltext
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