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contributor authorH. Sam Huang
contributor authorVikas Varshney
contributor authorJennifer L. Wohlwend
contributor authorAjit K. Roy
date accessioned2017-05-09T00:53:40Z
date available2017-05-09T00:53:40Z
date copyright41122
date issued2012
identifier issn1949-2944
identifier otherJNEMAA-926528#nano_3_3_031008.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/149963
description abstractIn this paper, we studied the effect of microscopic surface roughness on heat transfer between aluminum and water by molecular dynamic (MD) simulations and macroscopic surface roughness on heat transfer between aluminum and water by finite element (FE) method. It was observed that as the microscopic scale surface roughness increases, the thermal boundary conductance increases. At the macroscopic scale, different degrees of surface roughness were studied by finite element method. The heat transfer was observed to enhance as the surface roughness increases. Based on the studies of thermal boundary conductance as a function of system size at the molecular level, a procedure was proposed to obtain the thermal boundary conductance at the mesoscopic scale. The thermal boundary resistance at the microscopic scale obtained by MD simulations and the thermal boundary resistance at the mesoscopic scale obtained by the extrapolation procedure can be included and implemented at the interfacial elements in the finite element method at the macroscopic scale. This provides us a useful model, in which different scales of surface roughness can be included, for heat transfer analysis.
publisherThe American Society of Mechanical Engineers (ASME)
titleHeat Transfer at Aluminum–Water Interfaces: Effect of Surface Roughness
typeJournal Paper
journal volume3
journal issue3
journal titleJournal of Nanotechnology in Engineering and Medicine
identifier doi10.1115/1.4007584
journal fristpage31008
identifier eissn1949-2952
keywordsHeat transfer
keywordsAluminum
keywordsSurface roughness
keywordsElectrical conductance
keywordsWater
keywordsInterfacial thermal resistance
keywordsEngineering simulation
keywordsMolecular dynamics simulation
keywordsThermal conductivity AND Finite element methods
treeJournal of Nanotechnology in Engineering and Medicine:;2012:;volume( 003 ):;issue: 003
contenttypeFulltext


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