| contributor author | J. Lau | |
| contributor author | S. Wu | |
| contributor author | J. M. Lau | |
| date accessioned | 2017-05-09T00:49:21Z | |
| date available | 2017-05-09T00:49:21Z | |
| date copyright | 41244 | |
| date issued | 2012 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-926513#ep_134_4_041002.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/148561 | |
| description abstract | The pull force and displacement of gold (Au) and copper (Cu) wires in microelectronics are investigated in this study. Emphasis is placed on (1) the development of a set of equations for determining the internal forces and deformations of wires when subjected to an external pull force, (2) the determination of the maximum pull force (when the wire breaks) based on some failure criteria of the wires, and (3) the experimental verification of the present equations. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Pull Force and Displacement of Cu/Au Wire Interconnects | |
| type | Journal Paper | |
| journal volume | 134 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.4007233 | |
| journal fristpage | 41002 | |
| identifier eissn | 1043-7398 | |
| keywords | Force | |
| keywords | Wire AND Displacement | |
| tree | Journal of Electronic Packaging:;2012:;volume( 134 ):;issue: 004 | |
| contenttype | Fulltext | |
