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    A Novel Experimental Device for Seebeck Coefficient Measurements of Bulk Materials, Thin Films, and Nanowire Composites

    Source: Journal of Nanotechnology in Engineering and Medicine:;2011:;volume( 002 ):;issue: 001::page 11006
    Author:
    D. Pinisetty
    ,
    N. Haldolaarachchige
    ,
    R. V. Devireddy
    ,
    D. P. Young
    DOI: 10.1115/1.4003192
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: An experimental setup has been designed and built for measuring the Seebeck coefficient of bulk thermoelectric materials, thin films, and nanowire composites in the temperature range 200–350 K. The setup utilizes a differential method for measuring the Seebeck coefficient of the sample. The sample holder is a simple clamp design, utilizing a spring-loaded mounting system to load and hold the sample between two copper blocks, on which the electrical leads, as well as thermocouples, are mounted. The spring-loaded design also offers fast turn-around times, as the samples can be quickly loaded and unloaded. To measure the Seebeck coefficient, a temperature difference is generated across the sample by using four 10 kΩ resistive heaters mounted in series on one of the copper blocks. The resulting slope of the thermo-emf versus temperature difference plot is used to obtain the Seebeck coefficient at any temperature. Test measurements were carried out on bulk samples of nickel (Ni), bismuth-telluride (Bi2Te3), antimony-telluride (Sb2Te3), as well as thin films and nanowire composites of Ni.
    keyword(s): Nickel , Composite materials , Bulk solids , Thin films , Temperature , Nanowires , Copper , Thermocouples , Design AND Springs ,
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      A Novel Experimental Device for Seebeck Coefficient Measurements of Bulk Materials, Thin Films, and Nanowire Composites

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    http://yetl.yabesh.ir/yetl1/handle/yetl/147333
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    contributor authorD. Pinisetty
    contributor authorN. Haldolaarachchige
    contributor authorR. V. Devireddy
    contributor authorD. P. Young
    date accessioned2017-05-09T00:46:23Z
    date available2017-05-09T00:46:23Z
    date copyrightFebruary, 2011
    date issued2011
    identifier issn1949-2944
    identifier otherJNEMAA-28051#011006_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/147333
    description abstractAn experimental setup has been designed and built for measuring the Seebeck coefficient of bulk thermoelectric materials, thin films, and nanowire composites in the temperature range 200–350 K. The setup utilizes a differential method for measuring the Seebeck coefficient of the sample. The sample holder is a simple clamp design, utilizing a spring-loaded mounting system to load and hold the sample between two copper blocks, on which the electrical leads, as well as thermocouples, are mounted. The spring-loaded design also offers fast turn-around times, as the samples can be quickly loaded and unloaded. To measure the Seebeck coefficient, a temperature difference is generated across the sample by using four 10 kΩ resistive heaters mounted in series on one of the copper blocks. The resulting slope of the thermo-emf versus temperature difference plot is used to obtain the Seebeck coefficient at any temperature. Test measurements were carried out on bulk samples of nickel (Ni), bismuth-telluride (Bi2Te3), antimony-telluride (Sb2Te3), as well as thin films and nanowire composites of Ni.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleA Novel Experimental Device for Seebeck Coefficient Measurements of Bulk Materials, Thin Films, and Nanowire Composites
    typeJournal Paper
    journal volume2
    journal issue1
    journal titleJournal of Nanotechnology in Engineering and Medicine
    identifier doi10.1115/1.4003192
    journal fristpage11006
    identifier eissn1949-2952
    keywordsNickel
    keywordsComposite materials
    keywordsBulk solids
    keywordsThin films
    keywordsTemperature
    keywordsNanowires
    keywordsCopper
    keywordsThermocouples
    keywordsDesign AND Springs
    treeJournal of Nanotechnology in Engineering and Medicine:;2011:;volume( 002 ):;issue: 001
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
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