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contributor authorD. Pinisetty
contributor authorN. Haldolaarachchige
contributor authorR. V. Devireddy
contributor authorD. P. Young
date accessioned2017-05-09T00:46:23Z
date available2017-05-09T00:46:23Z
date copyrightFebruary, 2011
date issued2011
identifier issn1949-2944
identifier otherJNEMAA-28051#011006_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/147333
description abstractAn experimental setup has been designed and built for measuring the Seebeck coefficient of bulk thermoelectric materials, thin films, and nanowire composites in the temperature range 200–350 K. The setup utilizes a differential method for measuring the Seebeck coefficient of the sample. The sample holder is a simple clamp design, utilizing a spring-loaded mounting system to load and hold the sample between two copper blocks, on which the electrical leads, as well as thermocouples, are mounted. The spring-loaded design also offers fast turn-around times, as the samples can be quickly loaded and unloaded. To measure the Seebeck coefficient, a temperature difference is generated across the sample by using four 10 kΩ resistive heaters mounted in series on one of the copper blocks. The resulting slope of the thermo-emf versus temperature difference plot is used to obtain the Seebeck coefficient at any temperature. Test measurements were carried out on bulk samples of nickel (Ni), bismuth-telluride (Bi2Te3), antimony-telluride (Sb2Te3), as well as thin films and nanowire composites of Ni.
publisherThe American Society of Mechanical Engineers (ASME)
titleA Novel Experimental Device for Seebeck Coefficient Measurements of Bulk Materials, Thin Films, and Nanowire Composites
typeJournal Paper
journal volume2
journal issue1
journal titleJournal of Nanotechnology in Engineering and Medicine
identifier doi10.1115/1.4003192
journal fristpage11006
identifier eissn1949-2952
keywordsNickel
keywordsComposite materials
keywordsBulk solids
keywordsThin films
keywordsTemperature
keywordsNanowires
keywordsCopper
keywordsThermocouples
keywordsDesign AND Springs
treeJournal of Nanotechnology in Engineering and Medicine:;2011:;volume( 002 ):;issue: 001
contenttypeFulltext


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