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contributor authorYuan-Chang Lin
contributor authorJiun Pyng You
contributor authorNguyen T. Tran
contributor authorYongzhi He
contributor authorFrank G. Shi
date accessioned2017-05-09T00:43:14Z
date available2017-05-09T00:43:14Z
date copyrightMarch, 2011
date issued2011
identifier issn1528-9044
identifier otherJEPAE4-26312#011009_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/145825
description abstractTwo types of packaged white light emitting diodes in which one has a flat-top (FT) emitting surface and the other is a flat-top-with-lens (FTWL) type are fabricated by using the same leadframe and investigated on their optical properties, such as optical power, luminous efficiency, correlated color temperature (CCT), chromaticity coordinate, and color-rendering index (CRI), as a function of phosphor concentration in silicone encapsulant. It is found out that the optical power, CRI, and CCT decrease steadily as the phosphor ratio increases, while the luminous efficiency increases up to a level and then drops after a certain value of the phosphor ratio for both types of packages. Due to the totally internal reflection (TIR) at the encapsulant-air interface, the FT package shows a 10∼11% power (in mW) reduction compared with the FTWL package at the same phosphor concentration. However, it is demonstrated that the FT package provides a more efficient way of utilizing phosphor than the FTWL package based on the same targeted chromaticity coordinates due to the TIR effect inside, resulting in a reduced phosphor usage with a lumen output only about 3% lower than that of the FTWL package.
publisherThe American Society of Mechanical Engineers (ASME)
titlePackaging of Phosphor Based High Power White LEDs: Effects of Phosphor Concentration and Packaging Configuration
typeJournal Paper
journal volume133
journal issue1
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.4003216
journal fristpage11009
identifier eissn1043-7398
keywordsPhosphors
keywordsLight-emitting diodes AND Packaging
treeJournal of Electronic Packaging:;2011:;volume( 133 ):;issue: 001
contenttypeFulltext


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