contributor author | Satish Kumar | |
contributor author | Baratunde A. Cola | |
contributor author | Roderick Jackson | |
contributor author | Samuel Graham | |
date accessioned | 2017-05-09T00:43:11Z | |
date available | 2017-05-09T00:43:11Z | |
date copyright | June, 2011 | |
date issued | 2011 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26313#020906_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/145802 | |
description abstract | The exceptional electronic, thermal, mechanical, and optical characteristics of carbon nanotubes offer significant improvement in diverse applications such as flexible electronics, energy conversion, and thermal management. We present an overview of recent research on the fabrication, characterization and modeling of carbon nanotube (CNT) networks or ensembles for three emerging applications: thin-film transistors for flexible electronics, interface materials for thermal management and transparent electrodes for organic photovoltaics or light emitting diodes. Results from experimental measurements and numerical simulations to determine the electrical and thermal transport properties and characteristics of carbon nanotube networks and arrays used in the above applications are presented. The roles heterogeneous networks of semiconducting and metallic CNTs play in defining electrical, thermal, and optical characteristics of CNT ensembles are presented. We conclude with discussions on future research directions for electronics and packaging materials based on CNT ensembles. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | A Review of Carbon Nanotube Ensembles as Flexible Electronics and Advanced Packaging Materials | |
type | Journal Paper | |
journal volume | 133 | |
journal issue | 2 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.4004220 | |
journal fristpage | 20906 | |
identifier eissn | 1043-7398 | |
keywords | Carbon nanotubes | |
keywords | Networks AND Electrodes | |
tree | Journal of Electronic Packaging:;2011:;volume( 133 ):;issue: 002 | |
contenttype | Fulltext | |