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contributor authorXiaobo Sun
contributor authorAiping Yu
contributor authorPalanisamy Ramesh
contributor authorElena Bekyarova
contributor authorMikhail E. Itkis
contributor authorRobert C. Haddon
date accessioned2017-05-09T00:43:11Z
date available2017-05-09T00:43:11Z
date copyrightJune, 2011
date issued2011
identifier issn1528-9044
identifier otherJEPAE4-26313#020905_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/145801
description abstractWe report a 40% improvement of the thermal conductivity of graphite nanoplatelets–epoxy composites by chemical functionalization of graphite nanoplatelets utilizing nitric acid treatment, which also serves to enhance the spreadability of the material. FTIR and Raman spectroscopy confirmed the presence of a variety of oxygen functional groups at the edges and basal plane of the functionalized graphite nanoplatelets, which contributed to improved interaction with the polymer matrix. A comparative statistical analysis of the particle size distributions in pristine and functionalized graphite nanoplatelets based on scanning electron microscopy showed an increasing degree of exfoliation of the functionalized material. We compare the performance of the functionalized graphite nanoplatelets and carbon nanotubes as fillers in the polymer matrix and discuss the prospects for utilization of graphite nanoplatelets-based thermal interface materials in electronic packaging.
publisherThe American Society of Mechanical Engineers (ASME)
titleOxidized Graphite Nanoplatelets as an Improved Filler for Thermally Conducting Epoxy-Matrix Composites
typeJournal Paper
journal volume133
journal issue2
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.4003988
journal fristpage20905
identifier eissn1043-7398
keywordsComposite materials
keywordsFillers (Materials)
keywordsEpoxy adhesives
keywordsThermal conductivity
keywordsGraphite
keywordsPolymers
keywordsParticle size
keywordsCarbon nanotubes
keywordsFourier transform infrared spectroscopy AND oxidation
treeJournal of Electronic Packaging:;2011:;volume( 133 ):;issue: 002
contenttypeFulltext


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