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contributor authorB. L. Boyce
contributor authorL. N. Brewer
contributor authorM. J. Perricone
contributor authorM. K. Neilsen
date accessioned2017-05-09T00:43:09Z
date available2017-05-09T00:43:09Z
date copyrightSeptember, 2011
date issued2011
identifier issn1528-9044
identifier otherJEPAE4-26316#031009_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/145790
description abstractThe present study examines the thermomechanical strain-rate sensitivity of eutectic 63Sn–37Pb solder over a broad range of strain-rates from 0.0002 s–1 to 200 s–1 , thus encompassing failure events between 1 h and 1 ms, at temperatures ranging from −60 °C to + 100 °C. A newly developed servohydraulic tensile method enabled this broad range of strain-rates to be evaluated by a single technique, eliminating ambiguity caused by evaluation across multiple experimental methods. Two solder conditions were compared: a normalized condition representing a solder joint that has largely stabilized ∼30 days after solidification and an aged condition representing ∼30 years at near-ambient temperatures. The tensile behavior of both conditions exhibited dramatic temperature and strain-rate sensitivity. At 100 °C, the yield strength increased from 5 MPa at 0.0002 s–1 to 42 MPa at 200 s–1 , while at −60 °C, the yield strength increased from 57 MPa at 0.0002 s–1 to 71 MPa at 200 s–1 . The room temperature strain rate-dependent behavior was also measured for the lead free SAC396 alloy. The SAC alloy exhibited thermal strain-rate sensitivity similar to Sn–Pb over this temperature and strain-rate regime. Microstructural characterization using backscatter electron imaging and electron backscatter diffraction showed distinct, morphological changes of the microstructure for different thermomechanical conditions as well as some systematic changes in the crystallographic texture. However, very little intergranular rotation was observed over the range of thermomechanical conditions, suggesting the dominance of a grain boundary sliding (GBS) deformation mechanism. Finally, a recently developed unified-creep-plasticity constitutive model for solder deformation was found to describe the observed behavior with much higher fidelity than the common Johnson–Cook model.
publisherThe American Society of Mechanical Engineers (ASME)
titleOn the Strain Rate- and Temperature-Dependent Tensile Behavior of Eutectic Sn–Pb Solder
typeJournal Paper
journal volume133
journal issue3
journal titleJournal of Electronic Packaging
identifier doi10.1115/1.4004846
journal fristpage31009
identifier eissn1043-7398
keywordsPlasticity
keywordsTemperature
keywordsSolders
keywordsCreep AND Deformation
treeJournal of Electronic Packaging:;2011:;volume( 133 ):;issue: 003
contenttypeFulltext


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