| contributor author | M. Dube | |
| contributor author | T. Kundu | |
| date accessioned | 2017-05-09T00:43:05Z | |
| date available | 2017-05-09T00:43:05Z | |
| date copyright | December, 2011 | |
| date issued | 2011 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26319#045502_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/145761 | |
| description abstract | We respond to the technical content of the discussion as follows: | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Closure to “Discussion of ‘Yield Function for Solder Elastoviscoplastic Modeling’” (2005, ASME J. Electron. Packag., 127, pp. 147–156) | |
| type | Journal Paper | |
| journal volume | 133 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.4000902 | |
| journal fristpage | 45502 | |
| identifier eissn | 1043-7398 | |
| keywords | Electrons AND Solders | |
| tree | Journal of Electronic Packaging:;2011:;volume( 133 ):;issue: 004 | |
| contenttype | Fulltext | |
