YaBeSH Engineering and Technology Library

    • Journals
    • PaperQuest
    • YSE Standards
    • YaBeSH
    • Login
    View Item 
    •   YE&T Library
    • ASME
    • Journal of Manufacturing Science and Engineering
    • View Item
    •   YE&T Library
    • ASME
    • Journal of Manufacturing Science and Engineering
    • View Item
    • All Fields
    • Source Title
    • Year
    • Publisher
    • Title
    • Subject
    • Author
    • DOI
    • ISBN
    Advanced Search
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Archive

    Thermal Analysis of the Grinding Process

    Source: Journal of Manufacturing Science and Engineering:;1970:;volume( 092 ):;issue: 002::page 428
    Author:
    N. R. Des Ruisseaux
    ,
    R. D. Zerkle
    DOI: 10.1115/1.3427768
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A theoretical thermal analysis of the grinding process is developed. The investigation considers temperature in the vicinity of chip formation and relates this temperature to the temperature experienced by the workpiece surface which remains after grinding. The relation is established by considering grinding geometry. The results indicate that temperatures predicted at the region of chip formation can be substantially greater than those which result on the surface of the remaining workpiece. Furthermore, the temperature in the workpiece at a distance of several ten-thousands below the surface are virtually unaffected by chip shear plane temperature.
    keyword(s): Grinding , Thermal analysis , Temperature , Shear (Mechanics) AND Geometry ,
    • Download: (671.6Kb)
    • Show Full MetaData Hide Full MetaData
    • Get RIS
    • Item Order
    • Go To Publisher
    • Price: 5000 Rial
    • Statistics

      Thermal Analysis of the Grinding Process

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/145567
    Collections
    • Journal of Manufacturing Science and Engineering

    Show full item record

    contributor authorN. R. Des Ruisseaux
    contributor authorR. D. Zerkle
    date accessioned2017-05-09T00:42:43Z
    date available2017-05-09T00:42:43Z
    date copyrightMay, 1970
    date issued1970
    identifier issn1087-1357
    identifier otherJMSEFK-27551#428_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/145567
    description abstractA theoretical thermal analysis of the grinding process is developed. The investigation considers temperature in the vicinity of chip formation and relates this temperature to the temperature experienced by the workpiece surface which remains after grinding. The relation is established by considering grinding geometry. The results indicate that temperatures predicted at the region of chip formation can be substantially greater than those which result on the surface of the remaining workpiece. Furthermore, the temperature in the workpiece at a distance of several ten-thousands below the surface are virtually unaffected by chip shear plane temperature.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleThermal Analysis of the Grinding Process
    typeJournal Paper
    journal volume92
    journal issue2
    journal titleJournal of Manufacturing Science and Engineering
    identifier doi10.1115/1.3427768
    journal fristpage428
    journal lastpage433
    identifier eissn1528-8935
    keywordsGrinding
    keywordsThermal analysis
    keywordsTemperature
    keywordsShear (Mechanics) AND Geometry
    treeJournal of Manufacturing Science and Engineering:;1970:;volume( 092 ):;issue: 002
    contenttypeFulltext
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian