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contributor authorN. R. Des Ruisseaux
contributor authorR. D. Zerkle
date accessioned2017-05-09T00:42:43Z
date available2017-05-09T00:42:43Z
date copyrightMay, 1970
date issued1970
identifier issn1087-1357
identifier otherJMSEFK-27551#428_1.pdf
identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/145567
description abstractA theoretical thermal analysis of the grinding process is developed. The investigation considers temperature in the vicinity of chip formation and relates this temperature to the temperature experienced by the workpiece surface which remains after grinding. The relation is established by considering grinding geometry. The results indicate that temperatures predicted at the region of chip formation can be substantially greater than those which result on the surface of the remaining workpiece. Furthermore, the temperature in the workpiece at a distance of several ten-thousands below the surface are virtually unaffected by chip shear plane temperature.
publisherThe American Society of Mechanical Engineers (ASME)
titleThermal Analysis of the Grinding Process
typeJournal Paper
journal volume92
journal issue2
journal titleJournal of Manufacturing Science and Engineering
identifier doi10.1115/1.3427768
journal fristpage428
journal lastpage433
identifier eissn1528-8935
keywordsGrinding
keywordsThermal analysis
keywordsTemperature
keywordsShear (Mechanics) AND Geometry
treeJournal of Manufacturing Science and Engineering:;1970:;volume( 092 ):;issue: 002
contenttypeFulltext


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