contributor author | N. R. Des Ruisseaux | |
contributor author | R. D. Zerkle | |
date accessioned | 2017-05-09T00:42:43Z | |
date available | 2017-05-09T00:42:43Z | |
date copyright | May, 1970 | |
date issued | 1970 | |
identifier issn | 1087-1357 | |
identifier other | JMSEFK-27551#428_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/145567 | |
description abstract | A theoretical thermal analysis of the grinding process is developed. The investigation considers temperature in the vicinity of chip formation and relates this temperature to the temperature experienced by the workpiece surface which remains after grinding. The relation is established by considering grinding geometry. The results indicate that temperatures predicted at the region of chip formation can be substantially greater than those which result on the surface of the remaining workpiece. Furthermore, the temperature in the workpiece at a distance of several ten-thousands below the surface are virtually unaffected by chip shear plane temperature. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Thermal Analysis of the Grinding Process | |
type | Journal Paper | |
journal volume | 92 | |
journal issue | 2 | |
journal title | Journal of Manufacturing Science and Engineering | |
identifier doi | 10.1115/1.3427768 | |
journal fristpage | 428 | |
journal lastpage | 433 | |
identifier eissn | 1528-8935 | |
keywords | Grinding | |
keywords | Thermal analysis | |
keywords | Temperature | |
keywords | Shear (Mechanics) AND Geometry | |
tree | Journal of Manufacturing Science and Engineering:;1970:;volume( 092 ):;issue: 002 | |
contenttype | Fulltext | |