Coffee Stain Ring Effect and Nonuniform Material Removal in Chemical Mechanical PolishingSource: Journal of Tribology:;2010:;volume( 132 ):;issue: 004::page 41605Author:Jianguo Xin
DOI: 10.1115/1.4002108Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: When a drop of coffee dries on the counter-top, it leaves a dense, ringlike stain along its perimeter. Solids immersed in a drying drop will migrate toward the edge of the drop and form a solid ring. Such phenomena create ringlike stains and happen for a wide variety of surfaces, solvents, and solutes. It is referred to as the coffee stain ring effect. The phenomenon is caused by the outward microfluidic flow of the solute within the drop, which is driven by the evaporation of solvent. We show that the mechanism for the ring effect contributes to the nonuniform material removal in chemical mechanical polishing (CMP), specifically, at edges of blanket wafers causing the edge effect or at edges and corners of protrusive features on patterned wafers inducing the doming effect; metal dishing and dielectric erosion. By controlling the evaporation profile of the solvent in the slurry layer between the wafer surface and the polishing pad, such as making grooves or embedding the abrasive particles on the pad, or delivering the slurry from the bottom of the pad, one can improve the uniformity of material removal during the CMP process.
keyword(s): Flow (Dynamics) , Semiconductor wafers , Polishing , Slurries , Mechanisms , Evaporation , Microfluidics , Particulate matter , Drops , Erosion , Metals AND Drying ,
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contributor author | Jianguo Xin | |
date accessioned | 2017-05-09T00:41:05Z | |
date available | 2017-05-09T00:41:05Z | |
date copyright | October, 2010 | |
date issued | 2010 | |
identifier issn | 0742-4787 | |
identifier other | JOTRE9-28777#041605_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/144871 | |
description abstract | When a drop of coffee dries on the counter-top, it leaves a dense, ringlike stain along its perimeter. Solids immersed in a drying drop will migrate toward the edge of the drop and form a solid ring. Such phenomena create ringlike stains and happen for a wide variety of surfaces, solvents, and solutes. It is referred to as the coffee stain ring effect. The phenomenon is caused by the outward microfluidic flow of the solute within the drop, which is driven by the evaporation of solvent. We show that the mechanism for the ring effect contributes to the nonuniform material removal in chemical mechanical polishing (CMP), specifically, at edges of blanket wafers causing the edge effect or at edges and corners of protrusive features on patterned wafers inducing the doming effect; metal dishing and dielectric erosion. By controlling the evaporation profile of the solvent in the slurry layer between the wafer surface and the polishing pad, such as making grooves or embedding the abrasive particles on the pad, or delivering the slurry from the bottom of the pad, one can improve the uniformity of material removal during the CMP process. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Coffee Stain Ring Effect and Nonuniform Material Removal in Chemical Mechanical Polishing | |
type | Journal Paper | |
journal volume | 132 | |
journal issue | 4 | |
journal title | Journal of Tribology | |
identifier doi | 10.1115/1.4002108 | |
journal fristpage | 41605 | |
identifier eissn | 1528-8897 | |
keywords | Flow (Dynamics) | |
keywords | Semiconductor wafers | |
keywords | Polishing | |
keywords | Slurries | |
keywords | Mechanisms | |
keywords | Evaporation | |
keywords | Microfluidics | |
keywords | Particulate matter | |
keywords | Drops | |
keywords | Erosion | |
keywords | Metals AND Drying | |
tree | Journal of Tribology:;2010:;volume( 132 ):;issue: 004 | |
contenttype | Fulltext |