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    Forming Limit and Fracture Mode of Microscale Laser Dynamic Forming

    Source: Journal of Manufacturing Science and Engineering:;2010:;volume( 132 ):;issue: 006::page 61005
    Author:
    Ji Li
    ,
    Huang Gao
    ,
    Gary J. Cheng
    DOI: 10.1115/1.4002546
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The microscale laser dynamic forming (LDF) process is a high strain rate microfabrication technique, which uses a pulse laser to generate high pressure by vaporizing and ionizing an ablative coating, and thus produces complex 3D microstructures in thin foils. One of the most important features of this technique is ultrahigh strain rate (typically 106–7 s−1), which is theoretically favorable for increasing formability. However, due to the lack of measurement techniques in microscale and submicroscale, the formability of workpieces in LDF is hardly studied. In this article, experiments were carried out on aluminum foils to study the forming limits and fracture of thin films in LDF. The deformation depth was measured by an optical profilometer and the formed feature was observed using a focused ion beam and a scanning electron microscope. Meanwhile, a finite element model based on a modified Johnson–Cook constitutive model and a Johnson–Cook failure model was developed to simulate the mechanical and fracture behaviors of materials in LDF. Experimental results were used to verify the model. The verified model was used to predict the forming limit diagram of aluminum foil in LDF. The forming limit diagrams show a significant increase in formability compared with other metal forming processes.
    keyword(s): Deformation , Aluminum , Lasers , Aluminum foil , Fracture (Process) , Microscale devices , Failure , Thickness , Pressure AND Constitutive equations ,
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      Forming Limit and Fracture Mode of Microscale Laser Dynamic Forming

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    contributor authorJi Li
    contributor authorHuang Gao
    contributor authorGary J. Cheng
    date accessioned2017-05-09T00:39:12Z
    date available2017-05-09T00:39:12Z
    date copyrightDecember, 2010
    date issued2010
    identifier issn1087-1357
    identifier otherJMSEFK-28418#061005_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/143974
    description abstractThe microscale laser dynamic forming (LDF) process is a high strain rate microfabrication technique, which uses a pulse laser to generate high pressure by vaporizing and ionizing an ablative coating, and thus produces complex 3D microstructures in thin foils. One of the most important features of this technique is ultrahigh strain rate (typically 106–7 s−1), which is theoretically favorable for increasing formability. However, due to the lack of measurement techniques in microscale and submicroscale, the formability of workpieces in LDF is hardly studied. In this article, experiments were carried out on aluminum foils to study the forming limits and fracture of thin films in LDF. The deformation depth was measured by an optical profilometer and the formed feature was observed using a focused ion beam and a scanning electron microscope. Meanwhile, a finite element model based on a modified Johnson–Cook constitutive model and a Johnson–Cook failure model was developed to simulate the mechanical and fracture behaviors of materials in LDF. Experimental results were used to verify the model. The verified model was used to predict the forming limit diagram of aluminum foil in LDF. The forming limit diagrams show a significant increase in formability compared with other metal forming processes.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleForming Limit and Fracture Mode of Microscale Laser Dynamic Forming
    typeJournal Paper
    journal volume132
    journal issue6
    journal titleJournal of Manufacturing Science and Engineering
    identifier doi10.1115/1.4002546
    journal fristpage61005
    identifier eissn1528-8935
    keywordsDeformation
    keywordsAluminum
    keywordsLasers
    keywordsAluminum foil
    keywordsFracture (Process)
    keywordsMicroscale devices
    keywordsFailure
    keywordsThickness
    keywordsPressure AND Constitutive equations
    treeJournal of Manufacturing Science and Engineering:;2010:;volume( 132 ):;issue: 006
    contenttypeFulltext
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